Growth behavior of fine grains formed by diffusion induced recrystallization in the Cu(Zn) system

Authors: Goukon N.; Ikeda T.; Kajihara M.1

Source: Acta Materialia, Volume 48, Number 11, 30 June 2000 , pp. 2959-2968(10)

Publisher: Elsevier

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Keywords: Annealing; Copper; Grain boundaries; Kinetics; Recrystallization & recovery

Language: English

Document Type: Research article

DOI: 10.1016/S1359-6454(00)00096-3

Affiliations: 1: Department of Materials Science and Engineering, Tokyo Institute of Technology, 226-8502, Yokohama, Japan

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