Publisher: Elsevier

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Volume 47, Number 15, November 1999

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Thermal stability of a Cu/Ta multilayer: an intriguing interfacial reaction
pp. 3965-3975(11)
Authors: Lee, H.; Kwon, K.; Ryu, C.; Sinclair, R.

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Atomic structure of the Σ5 (310)/[001] symmetric tilt grain boundary in molybdenum
pp. 3977-3985(9)
Authors: Campbell, G.H.; Belak, J.; Moriarty, J.A.

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Structure and morphology of S-phase precipitates in aluminum
pp. 3987-3997(11)
Authors: Radmilovic, V.; Kilaas, R.; Dahmen, U.; Shiflet, G.J.

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Quantitative compositional mapping of Bi segregation to grain boundaries in Cu
pp. 3999-4008(10)
Authors: Keast, V.J.; Williams, D.B.

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An EELS study of segregation-induced grain-boundary embrittlement of copper
pp. 4009-4017(9)
Authors: Bruley, J.; Keast, V.J.; Williams, D.B.

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Three-dimensional atom probe studies of metallic multilayers
pp. 4019-4024(6)
Authors: Larson, D.J.; Petford-Long, A.K.; Cerezo, A.; Smith, G.D.W.

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Use of novel methods for the investigation of the boron distribution in CVD diamond
pp. 4025-4030(6)
Authors: Steeds, J.W.; Gilmore, A.; Charles, S.; Heard, P.; Howarth, B.; Butler, J.E.

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Grain boundary chemistry of alumina by high-resolution imaging SIMS
pp. 4031-4039(9)
Authors: Gavrilov, K.L.; Bennison, S.J.; Mikeska, K.R.; Levi-Setti, R.

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Thermodynamic aspects of the grain boundary segregation in Cu(Bi) alloys
pp. 4041-4046(6)
Authors: Chang, L.; Rabkin, E.; Straumal, B.B.; Baretzky, B.; Gust, W.

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Bismuth segregation at copper grain boundaries
pp. 4047-4060(14)
Authors: Alber, U.; Mullejans, H.; Ruhle, M.

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Direct atomic-scale imaging of ceramic interfaces
pp. 4061-4068(8)
Authors: Dickey, E.C.; Fan, X.; Pennycook, S.J.

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Metal-ceramic interfaces studied with high-resolution transmission electron microscopy
pp. 4077-4092(16)
Authors: de Hosson, J.T.M.; Groen, H.B.; Kooi, B.J.; Vitek, V.

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Interface adhesion: effects of plasticity and segregation
pp. 4093-4113(21)
Authors: Evans, A.G.; Hutchinson, J.W.; Wei, Y.

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Nanoindentation-induced defect-interface interactions: phenomena, methods and limitations
pp. 4115-4123(9)
Authors: Gerberich, W.W.; Kramer, D.E.; Tymiak, N.I.; Volinsky, A.A.; Bahr, D.F.; Kriese, M.D.

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Evidence for excess vacancies at sliding grain boundaries during superplastic deformation
pp. 4125-4129(5)
Authors: Vetrano, J.S.; Simonen, E.P.; Bruemmer, S.M.

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Structure of misfit dislocations in niobium-sapphire interfaces and strength of interfacial bonding: an atomistic study
pp. 4143-4152(10)
Authors: Levay, A.; Mobus, G.; Vitek, V.; Ruhle, M.; Tichy, G.

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Atomistics and mechanical properties of silicon
pp. 4153-4159(7)
Author: Spence, J.C.H.

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Polymer interfacial fracture simulations using cohesive elements
pp. 4161-4169(9)
Authors: Rahul-Kumar, P.; Jagota, A.; Bennison, S.J.; Saigal, S.; Muralidhar, S.

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Role of segregating dopants on the improved creep resistance of aluminum oxide
pp. 4197-4207(11)
Authors: Cho, J.; Wang, C.M.; Chan, H.M.; Rickman, J.M.; Harmer, M.P.

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Energetics and atomic transport at liquid metal/Al2O3 interfaces
pp. 4209-4220(12)
Authors: Saiz, E.; Cannon, R.M.; Tomsia, A.P.

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Fabrication and characterization of a bioactive glass coating on titanium implant alloys
pp. 4221-4224(4)
Authors: Bloyer, D.R.; Gomez-Vega, J.M.; Saiz, E.; McNaney, J.M.; Cannon, R.M.; Tomsia, A.P.

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Stability of f.c.c. titanium in titanium/aluminum multilayers
pp. 4225-4231(7)
Authors: Banerjee, R.; Dregia, S.A.; Fraser, H.L.

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Magnetism and microstructure: the role of interfaces
pp. 4233-4244(12)
Author: Krishnan, K.M.

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Evolution of the GMR-effect amplitude in copper/permalloy-multilayered thin films
pp. 4245-4252(8)
Authors: Hutten, A.; Mrozek, S.; Heitmann, S.; Hempel, T.; Bruckl, H.; Reiss, G.

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