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Publisher: Elsevier

Volume 8, Number 5, 1 August 1998

Integration of sensors and GaAs electronic circuits on a single chip
pp. 441-458(18)
Authors: Zaragoza, R.; Barna, L.; Blanchard, J.M.; Choi, J.R.; Park, S.

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Development of comfort sensing system for human environment
pp. 459-466(8)
Authors: Mahajan, G.R.; Prabhu, D.R.; Manchanda, V.K.; Badheka, L.P.; Kang, J.; Park, S.

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Si-to-Si fusion bonded touch mode capacitive pressure sensors
pp. 467-484(18)
Authors: Brey, R.R.; Butikofer, T.; McConnell, J.W.; Rogers, R.D.; Wang, Q.; Ko, W.H.

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A new process for the fabrication of miniature Fabry Perot spectrometers
pp. 485-504(20)
Authors: Fernandes, H.M.; Franklin, M.R.; Veiga, L.H.; Zavracky, P.M.; Hennenberg, E.; denis, K.; Xi, H.

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Mesoscopic systems: bridging from micromachined devices to macroscopic systems
pp. 521-534(14)
Authors: Duke, L.D.; Buffleben, M.; Bauersachs, L.A.; dewa, A.S.

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Mems microrelays
pp. 535-547(13)
Authors: Medcalf, B.D.; Manahan, S.E.; Larsen, D.W.; Wood, R.; Mahadevan, R.; Dhuler, V.; Dudley, B.; Cowen, A.; Hill, E.; Markus, K.

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Balance-approach for load-displacement measurement of microstructures
pp. 549-559(11)
Authors: Singh, D.; Wagh, A.S.; Tlustochowicz, M.; Jeong, S.Y.; Xiong, X.; Zou, Q.; Lu, D.; Wang, W.

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A positive displacement micropump for microdialysis
pp. 561-583(23)
Authors: Zitomer, D.H.; Shrout, J.D.; Cunneen, J.; Lin, Y.; Caraffini, S.; Boyd, J.G.; Hesketh, P.J.; Lunte, S.M.; Wilson, G.S.

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A pressure transducer with a single-sided multilevel structure by maskless etching technology
pp. 585-593(9)
Authors: Yang, H.; Shen, S.; Baoa, M.; Ren, J.; Shen, J.; Lu, D.

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Electrochemical etch stop engineering for bulk micromachining
pp. 595-612(18)
Authors: Park, J.; Song, M.; Ashruf, C.M.A.; French, P.J.; Sarro, P.M.; Bressers, P.M.M.C.; Kelly, J.J.

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