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Volume 20, Number 2, February 2001

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Molecular dynamics simulation of microcrack healing in copper
pp. 143-150(8)
Authors: Li S.; Gao K.W.; Qiao L.J.; Zhou F.X.; Chu W.Y.

Hypermolecular dynamics simulations of monovacancy diffusion
pp. 151-156(6)
Authors: Duan X.M.; Sun D.Y.; Gong X.G.

A tight binding calculation of delta-doped quantum wells in Si
pp. 177-180(4)
Authors: Gaggero-Sager L.M.; Vlaev S.; Monsivais G.

A two-dimensional model of electrochemical chloride removal from concrete
pp. 196-212(17)
Authors: Wang Y.; Li L.Y.; Page C.L.

Phonon spectrum and related thermodynamic properties of bcc-Fe with an edge dislocation
pp. 228-234(7)
Authors: Ya-Fang G.; Hai-Feng Z.; Hong-Bo L.; Dong-Liang Z.; Chong-Yu W.

Level set modeling of transient electromigration grooving
pp. 235-250(16)
Authors: Khenner M.; Averbuch A.; Israeli M.; Nathan M.; Glickman E.

On the modelling of interfacial transition behaviour in composite materials
pp. 251-266(16)
Authors: Haboussi M.; Dumontet H.; Billoet J.L.

The electronic structure of CuCl
pp. 267-274(8)
Authors: Ferhat M.; Bouhafs B.; Aourag H.; Zaoui A.; Certier M.

Stress analysis in hydroxyapatite/poly-l-lactide composite biomaterials
pp. 275-283(9)
Authors: Balac I.; Uskokovic P.S.; Ignjatovic N.; Aleksic R.; Uskokovic D.

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