Plasma etch models based on different plasma chemistry for micro-electro-mechanical-systems application

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Keywords: Anisotropy; Etch rates; Etching; High aspect ratio etching; MEMS; Sidewall passivation

Document Type: Research Article

DOI: http://dx.doi.org/10.1016/S0042-207X(02)00387-1

Affiliations: Central Scientific Instruments Organisation, Sector-30, 160 030, Chandigarh, India

Publication date: October 31, 2002

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