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Structure and properties of copper nitride films formed by reactive magnetron sputtering

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Keywords: Cu3N; Electrical resistivity; Hardness; Reactive sputtering; Structure

Document Type: Research Article

DOI: http://dx.doi.org/10.1016/S0042-207X(01)00425-0

Affiliations: Centre de Recherche sur les Ecoulements les Surfaces et les Transferts,(UMR CNRS 6000), Universite de Franche-Comte, Pole Universitaire, BP 71427, 25211 Cedex, Montbeliard, France

Publication date: June 1, 2002

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