ISSN 0042-207X
Publisher: Elsevier
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Properties of PdCu(110) single crystal alloy surfaces: Temperature-induced processes in the surface microstructure pp. 1405-1411(7) Author: Loboda-Cackovic J.
Laser beam effects on Cu and Ti in vacuum and in the air pp. 1413-1417(5) Authors: Milosavljevic A.; Ljubisavljevic B.; Sreckovic M.; Bojanic S.; Dinulovic M.
Fabrication of SnxGe1-x thin films with non-equilibrium composition pp. 1419-1422(4) Authors: Bennett J.C.; Egerton R.F.
Quartz resonator with SnO2 thin film as acoustic gas-sensor for NH3 pp. 1423-1425(3) Authors: Lazarova V.; Spassov L.; Gueorguiev V.; Andreev S.; Manolov E.; Popova L.
Study of hydrogen in hydrogenated Pd/semiconductor device by ERDA pp. 1427-1429(3) Authors: Srivastava P.C.; Singh U.P.; Pandey S.P.; Avasthi D.K.
An interpretation of outgassing characteristics of metals pp. 1431-1436(6) Authors: Moraw M.; Prasol H.
Defects developed in Ni-coatings deposited by the impulse plasma on metal substrates pp. 1437-1441(5) Author: Zdunek K.
Mechanisms of sputtered atoms energy spectra formation during ejection: Computer simulation study for two-component targets pp. 1443-1451(9) Authors: Samoilov V.N.; Korsakova O.S.; Tatur A.E.
Composite metal/C:H films prepared by unbalanced magnetron sputtering: Ni/C:H pp. 1453-1463(11) Authors: Biederman H.; Hlidek P.; Pesicka J.; Stundzia V.; Slavinska D.; Zemek J.; Kingdon R.J.; Howson R.P.
Modelling of the angular distribution of sputtered particles from roughened elemental and alloy targets pp. 1465-1472(8) Authors: Zhenxia W.; Wenmin W.; Wenyun L.; Chuanshan W.
Simulation of silicon dry etching through: A mask in low pressure fluorine-based plasma pp. 1473-1477(5) Authors: Knizikevicius R.; Galdikas A.; Grigonis A.; Rutkuniene Z.; Pranevicius L.; Rutknien Z.
Fine structure of scanning field emission microscope (SFEM) image pp. 1479-1482(4) Authors: Barwinski B.; Sendecki S.
Low-temperature treatment of Si/SiO2 structures in an RF hydrogen plasma pp. 1483-1486(4) Authors: Szekeres A.; Alexandrova S.
Microstructure and related properties of vapour deposited amorphous Sb2Se3 thin films pp. 1487-1490(4) Authors: Starbova K.; Dikova J.; Mankov V.; Starbov N.
Tungsten-aluminum brazed material application on to the internal target or radiation absorber in electron storage rings pp. 1491-1494(4) Authors: Momose T.; Nishida K.; Hirayama H.; Ishimaru H.; Toga T.
AES analysis of silicon nitride formation by 10 keV N+ and N2+ ion implantation pp. 1495-1499(5) Authors: Pan J.S.; Wee A.T.S.; Huan C.H.A.; Tan H.S.; Tan K.L.