Damage to Si substrates during SiO₂ etching: Opportunities of subsequent removal by optimized cleaning procedures

Authors: Richter H.H.; Wolff A.; Blum K.; Hoeppner K.; Kruger D.; Sorge R.

Source: Vacuum, Volume 47, Number 5, May 1996 , pp. 437-443(7)

Publisher: Elsevier

Language: English

Document Type: Research article

DOI: http://dx.doi.org/10.1016/0042-207X(95)00258-8

Affiliations: 1: Institut fur Halbleiterphysik, W-Korsing-Str 2, D-15230 Frankfurt (Oder), Germany

Publication date: 1996-05-01

• In this: publication
• By this: publisher
• In this Subject: Mechanics
• By this author: Richter H.H. ;  Wolff A. ;  Blum K. ;  Hoeppner K. ;  Kruger D. ;  Sorge R.

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