Vacuum

Exact deduction of activation energy population distributions from evolution rate measurements during tempering
pp. 401-403(3)
Author: Carter G.

The unimolecular decays of Al_n⁺/- and Cu_n⁺/- sputtered clusters: A comparison between competitive decay modes
pp. 405-407(3)
Authors: Bekkerman A.D.; Dzhemilev N.K.; Verkhoturov S.V.; Veryovkin I.V.

The effects of ion bombardment sputtering and atomic transport related roughening and smoothing on depth profiling resolution
pp. 409-420(12)
Author: Carter G.

Preferential sputtering and surface binding energy in metal silicides
pp. 421-424(4)
Authors: Zaporozchenko V.I.; Vojtusik S.S.; Stepanova M.G.

The effect of nitrogen content on the structure and mechanical properties of TiN films produced by magnetron sputtering
pp. 425-431(7)
Authors: Arnell R.D.; Colligon J.S.; Minnebaev K.F.; Yurasova V.E.

Energy dependence of the proton-induced convoy electron yield
pp. 433-436(4)
Authors: Kerkow H.; Gelfort S.; Stolle R.; Petukhov V.P.; Romanovski E.A.

Damage to Si substrates during SiO₂ etching: Opportunities of subsequent removal by optimized cleaning procedures
pp. 437-443(7)
Authors: Richter H.H.; Wolff A.; Blum K.; Hoeppner K.; Kruger D.; Sorge R.

Properties of ultrathin silver layers deposited on the Cu(001) face
pp. 445-449(5)
Authors: Nowicki M.; Mroz S.

Focused ion beam preparation of inclined planes in semiconductor materials
pp. 451-454(4)
Authors: Khamsehpour B.; Davies S.T.

Focused ion beam machining and deposition for nanofabrication
pp. 455-462(8)
Authors: Davies S.T.; Khamsehpour B.

Intermetallic generators of alkali metal with a seal
pp. 463-466(4)
Authors: Chuntonov K.A.; Mansurov V.V.