Evaluation of interfacial fracture toughness of a flip-chip package and a bimaterial system by a combined experimental and numerical method
Authors: Wang, J.; Zou, D.; Lu, M.; Ren, W.; Liu, S.
Source: Engineering Fracture Mechanics, Volume 64, Number 6, 1 December 1999 , pp. 781-797(17)
Document Type: Research Article
Affiliations: Department of Mechanical Engineering, Wayne State University, Detroit, USA
Publication date: 1999-12-01