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Publisher: Elsevier

Volume 61, Number 1, August 1998

Nanomechanical fracture-testing of thin films
pp. 1-20(20)
Authors: Kriese, M.D.; Boismier, D.A.; Moody, N.R.; Gerberich, W.W.

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An analysis of spalling in the microscratch test
pp. 75-81(7)
Author: Thouless, M.D.

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Formation and fracture of adhesive bonds between colloidal spheres
pp. 83-91(9)
Authors: Stainton, C.; Liang, W.; Kendall, K.

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Indentation response and cracking of sub-micron silica films on a polymeric substrate
pp. 93-105(13)
Authors: Andersson, R.; Toth, G.; Gan, L.; Swain, M.V.

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Film thickness effects on the fracture of tantalum nitride on aluminum nitride thin film systems
pp. 107-118(12)
Authors: Moody, N.R.; Medlin, D.; Boehme, D.; Norwood, D.P.

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Fractals and fracture
pp. 119-139(21)
Authors: Charkaluk, E.; Bigerelle, M.; Iost, A.

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Adhesion and debonding of multi-layer thin film structures
pp. 141-162(22)
Authors: Dauskardt, R.H.; Lane, M.; Ma, Q.; Krishna, N.

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Measurement of the niobium/sapphire interface toughness via delamination
pp. 163-171(9)
Authors: Ji, H.; Was, G.S.; Thouless, M.D.

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Three-dimensional fracture via large-scale molecular dynamics
pp. 173-187(15)
Authors: Zhou, S.J.; Lomdahl, P.S.; Voter, A.F.; Holian, B.L.

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