Ultrasonic Wave Propagation Problem in a Corroded Solder Joint

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This paper deals with the formulation and the solution of two-dimensional "in-plane" ultrasonic wave propagation problem in a corroded solder joint using the Direct Boundary Integral Equation Method (DBIEM). The quantitative evaluation of ultrasonic scattered field in a multi-layered system: a printed circuit board - thin base layer - solder joint with real geometrical and mechanical properties is presented. Finally, the effect of inter-crystallite corrosion on the scattered wave field of a solder joint and its influence on the solder joint reliability is discussed.

Document Type: Research Article

Publication date: July 1, 1999

More about this publication?
  • Acta Acustica united with Acustica, published together with the European Acoustics Association (EAA), is an international, peer-reviewed journal on acoustics. It publishes original articles on all subjects in the field of acoustics, such as general linear acoustics, nonlinear acoustics, macrosonics, flow acoustics, atmospheric sound, underwater sound, ultrasonics, physical acoustics, structural acoustics, noise control, active control, environmental noise, building acoustics, room acoustics, acoustic materials, acoustic signal processing, computational and numerical acoustics, hearing, audiology and psychoacoustics, speech, musical acoustics, electroacoustics, auditory quality of systems. It reports on original scientific research in acoustics and on engineering applications. The journal considers scientific papers, technical and applied papers, book reviews, short communications, doctoral thesis abstracts, etc. In irregular intervals also special issues and review articles are published.
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