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Volume 214, Number 3, June 2004

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Free Content Editorial
pp. 207-207(1)

Free Content FIB-induced damage in silicon
pp. 213-221(9)
Authors: RUBANOV, S.; MUNROE, P. R.

Free Content Using the FIB to characterize nanoparticle materials
pp. 222-236(15)
Authors: PERREY, C. R.; CARTER, C. B.; MICHAEL, J. R.; KOTULA, P. G.; STACH, E. A.; RADMILOVIC, V. R.

Free Content Application of the dual-beam FIB/SEM to metals research
pp. 237-245(9)
Authors: SIVEL, V. G. M.; VAN DEN BRAND, J.; WANG, W. R.; MOHDADI, H.; TICHELAAR, F. D.; ALKEMADE, P. F. A.; ZANDBERGEN, H. W.

Free Content Circuit editing of copper and low-k dielectrics in nanotechnology devices
pp. 246-251(6)
Authors: MOSSELVELD, F.; MAKAROV, V. V.; LUNDQUIST, T. R.; GRIFFIS, D. P.; RUSSELL, P. E.

Free Content Thermal stability of Ti and Pt nanowires manufactured by Ga+ focused ion beam
pp. 252-260(9)
Authors: INKSON, B. J.; DEHM, G.; WAGNER, T.

Free Content Using microscopic techniques to reveal the mechanism of anion exchange in crystalline co-ordination polymers
pp. 261-271(11)
Authors: THOMPSON, C.; CHAMPNESS, N. R.; KHLOBYSTOV, A. N.; ROBERTS, C. J.; SCHRÖDER, M.; TENDLER, S. J. B.; WILKINSON, M. J.

Free Content Off-axis electron holography of electrostatic potentials in unbiased and reverse biased focused ion beam milled semiconductor devices
pp. 287-296(10)
Authors: TWITCHETT, A. C.; DUNIN-BORKOWSKI, R. E.; HALLIFAX, R. J.; BROOM, R. F.; MIDGLEY, P. A.

Free Content Robust incremental compensation of the light attenuation with depth in 3D fluorescence microscopy
pp. 297-314(18)
Authors: KERVRANN, C.; LEGLAND, D.; PARDINI, L.

Free Content X-ray omni microscopy
pp. 315-327(13)
Authors: PAGANIN, D.; GUREYEV, T. E.; MAYO, S. C.; STEVENSON, A. W.; NESTERETS, YA. I.; WILKINS, S. W.

Free Content High-resolution wide-field surface plasmon microscopy
pp. 328-333(6)
Authors: STABLER, G.; SOMEKH, M. G.; SEE, C. W.

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