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ADHESION OF FOOD POWDERS WITH NONELECTROSTATIC AND ELECTROSTATIC COATING

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ABSTRACT

This study investigated the effects of powder resistivity, coating voltage, relative humidity (RH) and coating density on adhesion. Cocoa powder with a high resistivity (1.15 × 1013  Ωm) showed a stronger electrostatic adhesion than starch powder with a medium resistivity (2.56 × 1010  Ωm) and NaCl powder with a low resistivity (7.31 × 105  Ωm). The adhesion of starch and cocoa powders coated at 0, 40 and 95kV increased with increasing voltage. The adhesion at 0kV should be dominated by the van der Waals force, at 40 and 95kV by the electrostatic image force and at high RH by capillary force. Theoretical calculations were in the correct range, but the assumptions in those calculations make them unreliable. For nonelectrostatic coating (0kV), there was no significant change in adhesion when RH increased from 30 to 60%, while adhesion increased when RH increased from 60 to 80%. For electrostatic coating, the adhesion decreased when RH increased from 30 to 60%, but the adhesion at 80% RH was larger than the adhesion at 30 and 60% RH. For both nonelectrostatic and electrostatic coating, the adhesion force decreased as coating density increased to 1.0mg/cm2, but there was no significant change from 1.0mg/cm2 to 2.0mg/cm2.
PRACTICAL APPLICATIONS

The adhesion of seasoning powders on snack foods plays an important role in the product quality, but insufficient adhesion between food powders and the surface of snacks results in the seasonings falling off the snacks, leading to a poor distribution and waste of seasonings. This study suggests that the adhesion between food powders and targets can be effectively improved by controlling the properties of the powders, as well as optimizing coating conditions. For example, using food powders with a high resistivity and high voltage during electrostatic coating and increasing relative humidity will increase adhesion.
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Document Type: Research Article

Affiliations: Department of Food Science and Technology, The Ohio State University, 2015 Fyffe Road, Columbus, OH 43210

Publication date: 2012-04-01

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