Preparation of Nickel Ferrite–Copper Composite by Pressureless Infiltration
Pressureless infiltration was used to prepare a dense
Cu/ NiFe2 O4–10 NiO composite with interlocking microstructure. The results showed that the addition of Cu2 O
in Cu could improve the wettability between Cu and NiFe2 O4. The metallic phase content and densification of the resulting composite were 34 wt% and 99.2%, respectively. The resulting
composite had a flexural strength of 200 ± 20 MPa, a room‐temperature thermal diffusivity of 0.12 cm2/s, and an electrical conductivity of 1503 S/cm at 900°C.
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Document Type: Research Article
Publication date: 2012-12-01