Publisher: Wiley-Blackwell

Related content
Volume 30, Number 5, May 2007

< previous issue | all issues | next issue >

Favourites:Add to Favourites

Effect of strain waveform on creep-fatigue life for Sn–8Zn–3Bi solder
pp. 376-386(11)
Authors: YAMAMOTO, T.; IWATA, M.; SAKANE, M.; TSUKADA, Y.; NISHIMURA, H.

Favourites:Add to Favourites

Experimental and numerical studies on size and constraining effects in lead-free solder joints
pp. 387-399(13)
Authors: CUGNONI, J.; BOTSIS, J.; SIVASUBRAMANIAM, V.; JANCZAK-RUSCH, J.

Favourites:Add to Favourites
Favourites:Add to Favourites

Low-cycle fatigue properties of eutectic solders at high temperatures
pp. 413-419(7)
Authors: KARIYA, YOSHIHARU; SUGA, TADATOMO

Favourites:Add to Favourites
Favourites:Add to Favourites

Fatigue crack initiation and growth in solder alloys
pp. 443-457(15)
Authors: KANCHANOMAI, C.; MUTOH, Y.

Favourites:Add to Favourites
Favourites:Add to Favourites

Erratum
pp. 460-461(2)

Share Content

Access Key

Free Content
Free content
New Content
New content
Open Access Content
Open access content
Subscribed Content
Subscribed content
Free Trial Content
Free trial content
Cookie Policy
X
Cookie Policy
ingentaconnect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more