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Publisher: Wiley-Blackwell

Volume 30, Number 1, January 2007

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Characterization of strength properties of thin polycrystalline silicon films for MEMS applications
pp. 2-12(11)
Authors: Boroch, R.; Wiaranowski, J.; Mueller-Fiedler, R.; Ebert, M.; Bagdahn, J.

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Mode I and mixed mode fracture of polysilicon for MEMS
pp. 21-31(11)
Authors: CHO, S. W.; JONNALAGADDA, K.; CHASIOTIS, I.

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Aspects of rapid crack propagation in silicon
pp. 32-40(9)
Author: SHERMAN, D.

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Low-cycle fatigue in silicon: comparison with fcc metals
pp. 41-56(16)
Authors: GEORGE, A.; JACQUES, A.; LEGROS, M.

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Specimen aligning techniques in tensile and fatigue tests for thin films
pp. 64-71(8)
Authors: KIM, S.-W.; OH, C.-S.; LEE, H.-J.

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