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Automatic Optical Detection of Offset and Orientation of Electronic Component by Enhanced Active Shape Model (EASM)

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Conventional active shape model (ASM) applied to in-situ Automatic Optical Inspection (AOI) has the drawback of inability to locate the position, size or orientation of detected targets. This article presents an enhanced active shape model (EASM), which automatically detects both offset and orientation during component detection and positioning. The developed method is employed to inspect various electronic components mounted on printed circuit boards (PCBs). The accuracy of component positioning increases with increasing number of sample images used for building the model, and reaches its maximum at the threshold number of images, which varies with quality of the EASM in representing the detected component. Our findings validate the feasibility of applying the proposed approach to production environment.
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