Internal Stress Analysis on Corn Grain During Vacuum Drying
Authors: Zhang, Yaqiu; Zhu, Hang; Wu, Wenfu; Li, Junxing; Yin, Liyan
Source: Sensor Letters, Volume 10, Numbers 1-2, January/February 2012 , pp. 574-579(6)
Publisher: American Scientific Publishers
Abstract:In this paper, the mechanism of stress cracks and the corn stress and strain during vacuum drying were analyzed. The stress within corn grain was simulated. Simulation results show the peak maximum stress difference inside and outside the corn grain has been reduced with the drying time increases, but the inner peak maximum stress will be increased; the change of drying time has no significant impact on the distribution of the maximum stress; the higher the vacuum, the smaller the peak stress in the grain center. During the vacuum drying, a tempering process was added, the moisture in the central part of the corn grain gradually spread to the surface. During the tempering process, the moisture content of corn stable, thereby the moisture gradient inside the corn grain and the internal stress were reduced.
Document Type: Research Article
Publication date: January 1, 2012
- The growing interest and activity in the field of sensor technologies requires a forum for rapid dissemination of important results: Sensor Letters is that forum. Sensor Letters offers scientists, engineers and medical experts timely, peer-reviewed research on sensor science and technology of the highest quality. Sensor Letters publish original rapid communications, full papers and timely state-of-the-art reviews encompassing the fundamental and applied research on sensor science and technology in all fields of science, engineering, and medicine. Highest priority will be given to short communications reporting important new scientific and technological findings.
- Editorial Board
- Information for Authors
- Subscribe to this Title
- Terms & Conditions
- ingentaconnect is not responsible for the content or availability of external websites