Study for the Design of an Eddy Current Array Probe for the Imaging of Aeronautical Fastener Holes
Abstract:The design of an eddy current imaging array probe dedicated to the inspection of aeronautical fastener holes is presented. The probe aims at enhancing the characterisation of defects such as surface fatigue cracks as well as at simplifying the inspection procedures (limited probe displacements). In this paper, a general probe design featuring separate inducing and sensing functions is proposed and studied thanks to 3D finite element computations. Then, a first experimental validation of the structure is given. Finally alternative pickup sensor technologies are considered. A quantitative study of the influence of both the nature of the used sensors and their arrangement as part of a multisensor array is proposed and discussed.
Keywords: AERONAUTICAL FASTENER HOLES; BOBBIN COIL; DEFECT SIGNATURE; DEFECTS; EDDY CURRENTS; FINITE ELEMENT MODELLING; IMAGING PROBE; MICRO-MOULDED COILS; NONDESTRUCTIVE INSPECTION; PICKUP COIL ARRAY; PRINTED-CIRCUIT-BOARD COIL; SIGNAL TO NOISE RATIO; SPATIAL SAMPLING
Document Type: Research Article
Publication date: 2009-06-01
- The growing interest and activity in the field of sensor technologies requires a forum for rapid dissemination of important results: Sensor Letters is that forum. Sensor Letters offers scientists, engineers and medical experts timely, peer-reviewed research on sensor science and technology of the highest quality. Sensor Letters publish original rapid communications, full papers and timely state-of-the-art reviews encompassing the fundamental and applied research on sensor science and technology in all fields of science, engineering, and medicine. Highest priority will be given to short communications reporting important new scientific and technological findings.
- Editorial Board
- Information for Authors
- Subscribe to this Title
- Terms & Conditions
- Ingenta Connect is not responsible for the content or availability of external websites