We recently introduced a CMOS-compatible out-of-plane magnetic sensor based on Lorentz force. In the present paper, we analyze the impact of Joule effect on those sensors. At an experimental level, 3-D white light interferometry is used to assert the coupling of thermal, electromagnetic and mechanical effects while, at a simulation level, finite element analysis is performed to correlate device design to experimental data and expand our analysis to optimize new configurations.
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