If you are experiencing problems downloading PDF or HTML fulltext, our helpdesk recommend clearing your browser cache and trying again. If you need help in clearing your cache, please click here . Still need help? Email help@ingentaconnect.com

Suspended Si Microstructures Over Controlled Depth Micromachined Cavities for MEMS Based Sensing Devices

$113.00 plus tax (Refund Policy)

Buy Article:

Abstract:

Final shape of the silicon microstructures in wet anisotropic etching depends upon the relative etch rates (i.e., anisotropy) of different crystallographic planes. In order to fabricate the structures including curved shape (or sharp/rounded convex corners), dry anisotropic etching is used; because the wet etching exhibits severe undercutting at the sharp convex corners (or the edges not aligned along the 〈110〉 direction). The present research introduce the fabrication method of suspended silicon microstructures such as cantilever beams with sharp convex and concave corners, and with sharp convex and rounded concave corners of required thickness over controlled etch depth cavities. The fabrication process uses silicon direct wafer bonding and wet anisotropic etching in pure and surfactant added tetramethyl ammonium hydroxide (TMAH) water solutions. Surfactants in TMAH are used to reduce the etch rates of non-(100) planes, so that the undercutting at curved shape, edges aligned along non-〈110〉 directions and sharp convex corners can be minimized to a significant low levels. Various kinds of non-ionic surfactants NC-200, Triton-X-100 and polyethylene glycol (PEG) in a very small amount (0.1% by volume) were studied in 25 wt% TMAH solution.

Keywords: MEMS; SILICON DIRECT WAFER BONDING; SURFACTANT; TMAH; WET ANISOTROPIC ETCHING

Document Type: Research Article

DOI: http://dx.doi.org/10.1166/sl.2009.1003

Publication date: February 1, 2009

More about this publication?
  • The growing interest and activity in the field of sensor technologies requires a forum for rapid dissemination of important results: Sensor Letters is that forum. Sensor Letters offers scientists, engineers and medical experts timely, peer-reviewed research on sensor science and technology of the highest quality. Sensor Letters publish original rapid communications, full papers and timely state-of-the-art reviews encompassing the fundamental and applied research on sensor science and technology in all fields of science, engineering, and medicine. Highest priority will be given to short communications reporting important new scientific and technological findings.
  • Editorial Board
  • Information for Authors
  • Subscribe to this Title
  • Terms & Conditions
  • ingentaconnect is not responsible for the content or availability of external websites
Related content

Tools

Favourites

Share Content

Access Key

Free Content
Free content
New Content
New content
Open Access Content
Open access content
Subscribed Content
Subscribed content
Free Trial Content
Free trial content
Cookie Policy
X
Cookie Policy
ingentaconnect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more