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Thermal, Mechanical and MultiPhysics Simulation and Experiments in Microelectronics and Microsystems (EUROSIME'2006)
Authors: Marco, S.; Mariani, S.
Source: Sensor Letters, Volume 6, Number 1, February 2008, pp. i-ii(2)
Publisher: American Scientific Publishers
Document Type: Editorial
DOI: http://dx.doi.org/10.1166/sl.2008.001a
Publication date: February 1, 2008
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