Planar Microstructures Using Modified Surface Micromachining Process

$113.00 plus tax (Refund Policy)

Buy Article:

Abstract:

In this work, we report fabrication of completely planar microstructures for MEMS using RF sputtered ZnO as a new sacrificial material and RF sputtered SiO2 as a structural material. The microstructures fabricated by conventional surface micromachining process have two bends around the anchor point. These have been eliminated using a new modified process, which results in completely planar microstructures. For this purpose, trench formation and planarization techniques have been integrated with surface micromachining process. Different planarization techniques have been explored in the present work. Chemical mechanical polishing (CMP) using 1% HCl solution results in completely planarized surface over the trench area. The deposition of ZnO sacrificial layer was carried out in a RF (13.56 MHz) sputtering system using ZnO target. The silicon dioxide, used as structural layer material, was also deposited in the same sputtering system. Issues related with the selection of the appropriate sacrificial/structural layer materials, the deposition process and the sacrificial layer etching are addressed.

Keywords: CMP; MEMS; PLANAR MICROSTRUCTURES; RF SPUTTERING; SIO2; SURFACE MICROMACHINING; ZNO

Document Type: Research Article

DOI: http://dx.doi.org/10.1166/sl.2007.207

Publication date: June 1, 2007

More about this publication?
  • The growing interest and activity in the field of sensor technologies requires a forum for rapid dissemination of important results: Sensor Letters is that forum. Sensor Letters offers scientists, engineers and medical experts timely, peer-reviewed research on sensor science and technology of the highest quality. Sensor Letters publish original rapid communications, full papers and timely state-of-the-art reviews encompassing the fundamental and applied research on sensor science and technology in all fields of science, engineering, and medicine. Highest priority will be given to short communications reporting important new scientific and technological findings.
  • Editorial Board
  • Information for Authors
  • Subscribe to this Title
  • Terms & Conditions
  • ingentaconnect is not responsible for the content or availability of external websites
Related content

Tools

Favourites

Share Content

Access Key

Free Content
Free content
New Content
New content
Open Access Content
Open access content
Subscribed Content
Subscribed content
Free Trial Content
Free trial content
Cookie Policy
X
Cookie Policy
ingentaconnect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more