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Thermal Stability of Bi-Layer Thin Film Displacement Sensors

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The measuring system utilizes a personal computer based system using the LabVIEW® graphical programming package. The sensor is connected to a circuit that modulates the bi-layer thin film sensor signal, which arises from a controlled displacement, with a reference signal using the frequency modulation principle. This setup allows a high degree of software modularity and provides the features necessary for acquiring the sensor signal, analyzing, it and displaying the results. The bi-layer thin film sensor was placed within an environmental chamber where its thermal stability was tested over the temperature range of up to 180 °C. The temperature rise does cause inductance change, but the sensor signal remains unaffected due to the nature of the frequency modulation method, hence making it a temperature independent sensor that is needed in industry. Thus, having two materials, with different thermal coefficients of expansion in a bi-layer thin film sensor does not adversely influence the sensor signals.
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Document Type: Research Article

Publication date: 2007-03-01

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