Computer Assisted Design Study of a Non-Silicon Capacitive Pressure Sensor System

Authors: Meuwissen, M.H.H.; Veninga, E.P.; Tijdink, M.W.W.J.; Meijerink, M.G.H.

Source: Sensor Letters, Volume 4, Number 2, June 2006 , pp. 174-183(10)

Publisher: American Scientific Publishers

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Abstract:

The application of numerical techniques for the design of a capacitive pressure sensor system in non-silicon materials is described. These techniques have been used to address issues related to the thermo-mechanical performance of the sensor system. This comprises the selection of the materials and dimensions used for the sensor itself and the substrate on which it is mounted. Moreover, simulations are applied to aid in the selection of suitable solder interconnect materials and dimensions. Where possible, the accuracy of the numerical predictions is assessed by comparing them to experiments on physical prototypes. The application of numerical simulations allowed for a reduction in the number of physical tests and thereby a reduction in design time and costs. A sensor system was specified based on the outcome of the design studies. It proved to meet the functional demands imposed by the targeted application on a laboratory scale.

Keywords: NON-SILICON PRESSURE SENSOR SYSTEM; NUMERICAL MODELLING; SOLDERING; ASSEMBLY AND PACKAGING

Document Type: Research article

DOI: 10.1166/sl.2006.018

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