Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems

Author: Marco, Santiago

Source: Sensor Letters, Volume 4, Number 1, March 2006 , pp. 22-22(1)

Publisher: American Scientific Publishers

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Document Type: Editorial

DOI: http://dx.doi.org/10.1166/sl.2006.009

Publication date: March 1, 2006

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  • The growing interest and activity in the field of sensor technologies requires a forum for rapid dissemination of important results: Sensor Letters is that forum. Sensor Letters offers scientists, engineers and medical experts timely, peer-reviewed research on sensor science and technology of the highest quality. Sensor Letters publish original rapid communications, full papers and timely state-of-the-art reviews encompassing the fundamental and applied research on sensor science and technology in all fields of science, engineering, and medicine. Highest priority will be given to short communications reporting important new scientific and technological findings.
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