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Science of Advanced Materials (SAM) is an interdisciplinary peer-reviewed journal consolidating research activities in all aspects of advanced materials in the fields of science, engineering and medicine into a single and unique reference source. SAM provides the means for materials scientists, chemists, physicists, biologists, engineers, ceramicists, metallurgists, theoreticians and technocrats to publish original research articles as reviews with author's photo and short biography, full research articles and communications of important new scientific and technological findings, encompassing the fundamental and applied research in all latest aspects of advanced materials.

Publisher: American Scientific Publishers

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Volume 3, Number 4, August 2011

A Special Issue

A Special Issue on Advanced Thermoelectric Materials and Devices
pp. 515-516(2)
Authors: Poudeu, Pierre Ferdinand; Salvador, James; Sakamoto, Jeffrey

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Reviews

Mechanical Properties of Skutterudites
pp. 517-538(22)
Authors: Rogl, Gerda; Rogl, Peter

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Recent Advances in the Growth of Bi–Sb–Te–Se Thin Films
pp. 539-560(22)
Authors: Wang, Guoyu; Endicott, Lynn; Uher, Ctirad

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Electronic Transport in Old and New Thermoelectric Materials
pp. 561-570(10)
Author: Singh, David J.

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Research Articles

Effect of Sn Doping on the Thermoelectric Performance of the Complex p-Type Zr0.5Hf0.5Co0.3Ir0.7Sb1–ySn y Half-Heusler System
pp. 571-576(6)
Authors: Takas, Nathan J.; Shabetai, Michael R.; Poudeu, Pierre F. P.

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Temperature Dependent Tensile Fracture Stress of n- and p-Type Filled-Skutterudite Materials
pp. 577-586(10)
Authors: Salvador, J. R.; Yang, J.; Wereszczak, A. A.; Wang, H.; Cho, J. Y.

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Effect of Mg-Doping on the Thermal Stability of Thermoelectric Zn4Sb3
pp. 592-595(4)
Authors: Yin, Hao; Iversen, Bo. B.

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Improving Thermoelectric Performance of Pulverized p-Type Bi2Te3 via a Grain Boundary Engineering Approach
pp. 596-601(6)
Authors: Su, Zhe; He, Jian; Ji, Xiaohua; Gothard, Nicolas; Tritt, Terry M.

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Doping Effects on the Thermoelectric Properties of Cu3SbSe4
pp. 602-606(5)
Authors: Skoug, Eric J.; Cain, Jeffrey D.; Majsztrik, Paul; Kirkham, Melanie; Lara-Curzio, Edgar; Morelli, Donald T.

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Microstructure and Thermoelectric Properties of Mechanically Alloyed Zr0.5Hf0.5Ni0.8Pd0.2Sn0.99Sb0.01/WO3 Half-Heusler Composites
pp. 607-614(8)
Authors: Misra, Dinesh K.; Makongo, Julien P. A.; Sahoo, Pranati; Shabetai, Michael R.; Paudel, Pravin; Stokes, Kevin L.; Poudeu, Pierre F. P.

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Thermoelectric Properties of In-Doped PbTe
pp. 615-620(6)
Authors: Guch, Mykhailo; Sankar, Cheriyedath Raj; Salvador, James; Meisner, G.; Kleinke, Holger

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Skutterudite-Based Thermoelectric Technology for Waste Heat Recovery: Progress Towards a 1 kW Generator
pp. 621-632(12)
Authors: Sakamoto, Jeff S.; Schock, H.; Caillat, T.; Fleurial, J.-P.; Maloney, R.; Lyle, M.; Ruckle, T.; Timm, E.; Zhang, L.

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Investigation of the Effect of NiO Nanoparticles on the Transport Properties of Zr0.5Hf0.5Ni1–x Pd x Sn0.99Sb0.01 (x = 0 and 0.2)
pp. 633-638(6)
Authors: Yaqub, Rumana; Sahoo, Pranti; Makongo, Julien P. A.; Takas, Nathan; Poudeu, Pierre F. P.; Stokes, Kevin L.

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Probing the Effects of Alloying, Grain Size, and Turbostratic Disorder on Thermal Conductivity
pp. 639-645(7)
Authors: Mortensen, Clay; Beekman, Matt; Johnson, David C.

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High Temperature Thermoelectric Properties of Yb14–x Ca x MnSb11 Made by Reaction of the Elements
pp. 646-651(6)
Authors: Uvarov, Catherine A.; Rauscher, Japheth F.; Kauzlarich, Susan M.

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The Effect of Tm Substitution on the Thermoelectric Performance of Yb14MnSb11
pp. 652-658(7)
Authors: Uvarov, Catherine A.; Abdusalyamova, M. N.; Makhmudov, F.; Star, Kurt; Fleurial, Jean-Pierre; Kauzlarich, Susan M.

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Young's Modulus and Hardness of Zr0.5Hf0.5Ni x Pd1– x Sn0.99Sb0.01 Half-Heusler Compounds
pp. 659-666(8)
Authors: Verges, Melody A.; Schilling, Paul J.; Upadhyay, Puja; Miller, William K.; Yaqub, Rumana; Stokes, Kevin L.; Poudeu, Pierre F. P.

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Prospective Thermoelectric Materials: (AgSbTe2)100–x (SnTe) x Quaternary System (x = 80, 85, 90, and 95)
pp. 667-671(5)
Authors: Shi, X.; Salvador, J. R.; Yang, J.; Wang, H.

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Solid State Refrigerator for Microchips
pp. 672-681(10)
Authors: Mathew, B.; John, T.J.; Ogbonnaya, E.; Champagne, C.; Weiss, L. W.; Hegab, H.

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Waste Heat Recovery Using Thermoelectric Oxide Materials
pp. 682-686(5)
Author: Funahashi, Ryoji

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