Nanoetching Process on Silicon Solar Cell Wafers During Mass Production for Surface Texture Improvement
Major challenge in nanotechnology is to improve the solar cells efficiency. This can be achieved by controlling the silicon solar cell wafer surface structure. Herein, we report a KOH wet etching process along with an ultrasonic cleaning process to improve the surface texture of silicon
solar cell wafers. We evaluated the KOH temperature, concentration, and ultra-sonication time. It was observed that the surface texture of the silicon solar wafer changed from a pyramid shape to a rectangular shape under edge cutting as the concentration of the KOH solution was increased.
We controlled the etching time to avoid pattern damage and any further increase of the reflectance. The present study will be helpful for the mass processing of silicon solar cell wafers with improved reflectance.
Document Type: Research Article
Publication date: 01 December 2014
- Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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