Formation of Metal and Dielectric Liners Using a Solution Process for Deep Trench Capacitors
We demonstrated the feasibility of metal and dielectric liners using a solution process for deep trench capacitor application. The deep Si trench via with size of 10.3μm and depth of 71μm were fabricated by Bosch process in deep reactive ion etch (DRIE) system. The aspect ratio was about 7. Then, nano-Ag ink and poly(4-vinylphenol) (PVPh) were used to form metal and dielectric liners, respectively. The thicknesses of the Ag and PVPh liners were about 144 and 830 nm, respectively. When the curing temperature of Ag film increased from 120 to 150°C, the sheet resistance decreased rapidly from 2.47 to 0.72 Ω/sq and then slightly decreased to 0.6 Ω/sq with further increasing the curing temperature beyond 150°C. The proposed liner formation method using solution process is a simple and cost effective process for the high capacity of deep trench capacitor.
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Document Type: Research Article
Publication date: 2012-07-01
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