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Tensile Properties and Thermal Shock Reliability of Sn–Ag–Cu Solder Joint with Indium Addition

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Abstract:

The thermal shock reliability and tensile properties of a newly developed quaternary Sn–1.2Ag–0.5Cu–0.4In (wt%) solder alloy were investigated and compared to those of ternary Sn–Ag–Cu based Pb-free solder alloys. It was revealed that the Sn–1.2Ag–0.5Cu–0.4In solder alloy shows better thermal shock reliability compared to the Sn–1.0Ag–0.5Cu and Sn–3.0Ag–0.5Cu solder alloys. The quaternary alloy has higher strength than Sn–1.0Ag–0.5Cu alloy, and higher elongation than Sn–3.0Ag–0.5Cu alloy. It was also revealed that the addition of indium promotes the formation of Ag3(Sn, In) phase in the solder joint during reflow process.

Document Type: Research Article

DOI: http://dx.doi.org/10.1166/jnn.2012.5616

Publication date: April 1, 2012

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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