Tensile Properties and Thermal Shock Reliability of Sn–Ag–Cu Solder Joint with Indium Addition
The thermal shock reliability and tensile properties of a newly developed quaternary Sn–1.2Ag–0.5Cu–0.4In (wt%) solder alloy were investigated and compared to those of ternary Sn–Ag–Cu based Pb-free solder alloys. It was revealed that the Sn–1.2Ag–0.5Cu–0.4In solder alloy shows better thermal shock reliability compared to the Sn–1.0Ag–0.5Cu and Sn–3.0Ag–0.5Cu solder alloys. The quaternary alloy has higher strength than Sn–1.0Ag–0.5Cu alloy, and higher elongation than Sn–3.0Ag–0.5Cu alloy. It was also revealed that the addition of indium promotes the formation of Ag3(Sn, In) phase in the solder joint during reflow process.
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Document Type: Research Article
Publication date: 2012-04-01
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