Effect of Curing Temperature on Nano-Silver Paste Ink for Organic Thin-Film Transistors
Authors: Kim, Minseok; Koo, Jae Bon; Baeg, Kang-Jun; Noh, Yong-Young; Yang, Yong Suk; Jung, Soon-Won; Ju, Byeong-Kwon; You, In-Kyu
Source: Journal of Nanoscience and Nanotechnology, Volume 12, Number 4, April 2012 , pp. 3272-3275(4)
Publisher: American Scientific Publishers
Abstract:Silver (Ag) metal electrode having 20 μm channel length was printed by reverse offset printing (ROP) using nano-silver paste ink for the source/drain of organic thin-film transistors (OTFT). Specific resistance and surface roughness of printed Ag electrodes with increasing curing temperature were investigated, and surface morphology and grain growth mechanism were systematically verified using a scanning electron microscope (SEM) and atomic force microscope (AFM) in order to obtain an optimized ROP Ag electrode. The Ag electrode was applied to fabricate top-gate/bottom-contact poly(3-hexylthiophene) OTFT devices, which showed reproducible OTFT characteristics such as the field-effect mobility, threshold voltage, and an on/off-current ratio of ∼10−3 cm2/Vs, 0.36 V, and ∼102, respectively.
Document Type: Research Article
Publication date: April 1, 2012
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