Electrochemical Migration Characteristics of Screen-Printed Silver Patterns on FR-4 Substrate
We evaluated the electrical reliability of screen-printed silver (Ag) patterns sintered at various temperatures under variable bias voltages. Comb-type patterns were screen-printed onto a flame resistance-4 substrate using a commercial Ag nanopaste (24 nm in diameter, 73 wt% of Ag nanopar-ticles). The printed patterns were then sintered for 30 min in air at various temperatures ranging from 100 °C to 200 °C. The microstructures and thickness profiles of the sintered conductive patterns were identified with a field emission scanning electron microscope and a 3-D surface profiler, respectively. In this study, the phenomenon of electrochemical migration was investigated with a water drop test with deionized water. These results showed that the time required by dendrites to bridge from a cathode to an anode was affected by the sintering temperature and applied voltage; when the sintering temperature was 200 °C, the time to achieve a short circuit was nearly four times that of the sample sintered at 100 °C, and while the applied voltage increased from 3 V to 9 V, the time to reach a short circuit decreased, on average, by 11%.
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Document Type: Research Article
Publication date: 2012-04-01
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