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Adhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D Integration

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Abstract:

Hybrid bonding, an emerging bonding approach with high yield and reliability, can achieve vertical interconnection with adhesive serving reinforcement of the mechanical stability between stacked ICs. To develop metal/adhesive hybrid bonding technology, four kinds of polymer materials, BCB, SU-8, AL-Polymer, and PI, were evaluated as the bonding adhesive. The compatibility between each polymer and metal was investigated, and the application range of each material was established thereof. Furthermore, the scheme of Cu–Sn–Cu interconnection hybridized with patterned BCB was designed and evaluated. Two key factors were discussed and optimized to perform the bonding integrity. The evaluation results and successful metal/adhesive hybrid bonding demonstration are disclosed in the paper.

Document Type: Research Article

DOI: https://doi.org/10.1166/jnn.2012.5176

Publication date: 2012-03-01

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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