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Study on the Resin Temperature Developments During UV Imprinting Process

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Abstract:

During the imprinting process, the temperature of the UV resin increases as the phase of the resin changes from fluid into solid. During UV curing, some amount of heat is released from inside the resin and transferred into contacting materials. The heat flow is measured with photo-DSC, and other related thermal and mechanical properties of the resin. With the measured material properties, the temperature developments both inside of the resin layer and along the interfaces of the contacting materials are computed. During the UV exposure period, the thermal deformation of the mold, which directly influences the pattern distortion are investigated. Under this condition, the developments of strain and temperature inside the mold structure including the UV resin of 3-D shape are computed with the transient time scale during UV curing according to the thickness of resin layer. These computational results are expected to provide useful information for better designs of the imprinting mold and the process condition.

Keywords: CONTACT PRESSURE; MOLD THERMAL DEFORMATION; PHOTO-DSC; UV IMPRINTING

Document Type: Research Article

DOI: https://doi.org/10.1166/jnn.2012.4705

Publication date: 2012-02-01

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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