The Model of Nano-Scale Copper Particle Removal from Silicon Surface in High Pressure CO2+H2O and CO2+H2O+IPA Cleaning Solutions
Abstract:This study focuses on the description of the static forces in CO2-H2O and CO2-H2O-IPA cleaning solutions with a separate fluid phase entrapped between nano-scale copper particles and a silicon surface. Calculations demonstrate that increasing the pressure of the cleaning system decreases net adhesion force (NAF) between the particle and silicon. The NAF of a particle for in CO2-H2O-IPA system is less than that in CO2-H2O system, suggesting that the particles enter into bulk layer more easily as the CO2-H2O cleaning system is added IPA.
Document Type: Research Article
Publication date: 2011-12-01
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