Authors: Gelard, Isabelle; Chichignoud, Guy; Blanquet, Elisabeth; Xuan, Hoan Nguyen; Cruz, Ruben; Jimenez, Carmen; Sarigiannidou, Eirini; Zaidat, Kader

Source: Journal of Nanoscience and Nanotechnology, Volume 11, Number 9, September 2011 , pp. 8318-8322(5)

Publisher: American Scientific Publishers

Abstract:

Highly crystallized silicon layers were grown on metal sheets at high temperature (950 °C) by thermal CVD from silane. An intermediate buffer layer was mandatory to prevent interdiffusion and silicide formation but also to compensate lattice parameters and thermal expansion coefficients mismatches between metal and silicon and ideally transfer some crystalline properties (grain size, texture) from the substrate to the silicon layer. After a thermodynamic study, aluminum nitride or titanium nitride diffusion barrier layers were selected and processed by CVD. The structure and the interfaces stabilities of these silicon/nitride/metal stacks were studied by field effect gun scanning and transmission electron microscopy, X-ray diffraction, Raman and energy dispersive X-ray spectroscopy. As a result, TiN deposited by CVD appears to be an efficient material as a buffer layer between steel and silicon.

Keywords: SILICON ON METALS; NITRIDE BUFFER LAYER; CVD; SOLAR CONVERSION

Document Type: Research article

DOI: http://dx.doi.org/10.1166/jnn.2011.5077

Publication date: 2011-09-01

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• Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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