Fabrication of Nano-Scale Cu Bond Pads with Seal Design in 3D Integration Applications
Authors: Chen, K. N.; Tsang, C. K.; Wu, W. W.; Lee, S. H.; Lu, J. Q.
Source: Journal of Nanoscience and Nanotechnology, Volume 11, Number 4, April 2011 , pp. 3336-3339(4)
Publisher: American Scientific Publishers
Abstract:A method to fabricate nano-scale Cu bond pads for improving bonding quality in 3D integration applications is reported. The effect of Cu bonding quality on inter-level via structural reliability for 3D integration applications is investigated. We developed a Cu nano-scale-height bond pad structure and fabrication process for improved bonding quality by recessing oxides using a combination of SiO2 CMP process and dilute HF wet etching. In addition, in order to achieve improved waferlevel bonding, we introduced a seal design concept that prevents corrosion and provides extra mechanical support. Demonstrations of these concepts and processes provide the feasibility of reliable nano-scale 3D integration applications.
Document Type: Research Article
Publication date: April 2011
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