A model to predict the enhanced thermal conductivity of water based copper nanofluid on the basis of molecular dynamics simulation coupled with stochastic simulation shows for the first time that the temperature of a copper nanoparticle colliding with a heat source can rise rapidly within the short collision period (e.g., 10–50 ps) estimated by impact dynamics due to phonon transfer. Thereafter the particles undergo Brownian movement in the base fluid and transfer the excess heat in about 2 to 3 ms to the surrounding fluid resulting in an appreciable enhancement of the thermal conductivity of the fluid. Microconvection has minor contribution to the enhanced thermal conductivity of nanofluids. The predicted thermal conductivity of nanofluid and its variation with the volume fraction of the nanoparticles agree well with the present experiments, as well as, with the data reported in the literature.
Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.