Fabrication of Nanostructured Deoxidized Low-Phosphorous Copper Processed by Three-Layer Stack Accumulative Roll-Bonding
Abstract:A nanostructured deoxidized low-phosphorous copper (DLPC) was fabricated by three-layer stack accumulative roll-bonding (ARB) process. The microstructural evolution and the variation of mechanical properties with three-layer stack ARB were investigated in detail. It was found that the microstructure has been evolved from a dislocation cell structure to ultrafine grained structure as the number of ARB cycles increases. In addition, the mean spacing of grain boundaries, which was 45 m in initial material, reduced to 2.1 m after 1 cycle, 360 nm after 3 cycles, 250 nm after 5 cycles, then 170 nm after 7 cycles, progressively. The fraction of high-angle grain boundaries after 1-cycle ARB was no more than 0.27, but it increased with the number of ARB cycles, and became surprisingly more than 0.7 after 7-cycle ARB. The tensile strength increased with the number of ARB cycles, and then after 7 cycles it reached about 600 MPa, which is about 2.5 times higher than that of the initial material. Therefore, the three-layer stack ARB is very effective for development of ultrafine grains and high strengthening of DLPC alloy.
Document Type: Research Article
Publication date: February 1, 2011
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