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Flexibility of Silver Conductive Circuits Screen-Printed on a Polyimide Substrate

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The microstructural evolution and mechanical characteristics, especially folding endurance, of screen-printed Ag circuits under various sintering conditions were investigated. The circuits were constructed on a polyimide (PI) film by a screen printing technique using a commercial Ag nanopaste. The sintering temperature and time were raised from 150 to 300 °C and from 15 min to 1 hour while the sintering time and temperature were fixed at 30 min and 200 °C, respectively. The Massachusetts Institute of Technology (MIT)-type folding endurance tester was used to measure the flexibility of the screen-printed Ag circuits. We observed the change of electrical resistance while the printed Ag patterns were being folded. The folding endurance was better at lower sintering temperature and time, which was explained by the microstructural evolution and macrostructural change of the screen-printed Ag circuits; however, the electrical characteristics were generally poor. Further research is therefore required to improve the electrical and mechanical properties of patterns using direct printing technologies simultaneously.
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Keywords: AG NANOPASTE; FLEXIBLE ELECTRONICS; MIT FOLDING ENDURANCE TEST; SCREEN PRINTING; SINTERING CONDITION

Document Type: Research Article

Publication date: 2011-02-01

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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