Provider: Ingenta Connect Database: Ingenta Connect Content: application/x-research-info-systems TY - ABST AU - Bai, Anqi AU - Cheng, Buwen AU - Wang, Xiaofeng AU - Xue, Chunlai AU - Zuo, Yuhua AU - Wang, Qiming TI - Fabrication of Silicon-Based Template-Assisted Nanoelectrode Arrays and Ohmic Contact Properties Investigation JO - Journal of Nanoscience and Nanotechnology PY - 2010-11-01T00:00:00/// VL - 10 IS - 11 SP - 7428 EP - 7431 KW - PAA KW - ELECTROLESS DEPOSITION KW - SEM KW - I-V KW - NANOELECTRODE ARRAYS N2 - A convenient fabrication technology for large-area, highly-ordered nanoelectrode arrays on silicon substrate has been described here, using porous anodic alumina (PAA) as a template. The ultrathin PAA membranes were anodic oxidized utilizing a two-step anodization method, from Al film evaporated on substrate. The purposes for the use of two-step anodization were, first, improving the regularity of the porous structures, and second reducing the thickness of the membranes to 100∼200 nm we desired. Then the nanoelectrode arrays were obtained by electroless depositing Ni–W alloy into the through pores of PAA membranes, making the alloy isolated by the insulating pore walls and contacting with the silicon substrates at the bottoms of pores. The Ni–W alloy was also electroless deposited at the back surface of silicon to form back electrode. Then ohmic contact properties between silicon and Ni–W alloy were investigated after rapid thermal annealing. Scanning electron microscopy (SEM) observations showed the structure characteristics, and the influence factors of fabrication effect were discussed. The current–voltage (IV) curves revealed the contact properties. After annealing in N2 at 700 °C, good linear property was shown with contact resistance of 33 Ω, which confirmed ohmic contacts between silicon and electrodes. These results presented significant application potential of this technology in nanosize current-injection devices in optoelectronics, microelectronics and bio-medical fields. UR - https://www.ingentaconnect.com/content/asp/jnn/2010/00000010/00000011/art00100 M3 - doi:10.1166/jnn.2010.2845 UR - https://doi.org/10.1166/jnn.2010.2845 ER -