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A Low Sintering Temperature and Electrical Performance of Nanoparticle Copper Ink for Use in Ink-Jet Printing

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Copper nanoparticles were successfully synthesized from copper chloride with various capping agents. The formation of copper nanoparticles was controlled by varying the species and concentration of the capping agents. The Cu nanoparticles were easily re-dispersed into n-tetradecane, and Cu films were prepared by solution deposition. The thin Cu films form a highly conducting film at low temperature via sintering due to the high surface area to volume ratio. The films were thermally treated at a range of temperatures and then their morphology and resistivity were analyzed. When the Cu films were sintered at 200 °C, their electrical resistivity was about 40 μΩ·cm.
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Keywords: CU NANOPARTICLES; METAL NANO-INK; SINTERING

Document Type: Research Article

Publication date: 2010-10-01

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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