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Fabrication and Application of Polyimide Plastic Molds for Nanoimprint Lithography

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In this work, we have developed low-cost, high modulus, flexible, and UV transparent polyimide plastic molds for nanoimprint lithography (NIL). Different structures of poly(amic acids) (PAA) and polyimides (PI) have been synthesized. By casting the PAA or PI solutions on a silicon master, flexible but still rigid plastic molds can be produced. The advantages of the PI molds are: (1) high glass-transition temperatures (Tg) up to 310 °C, (2) high thermal stability over 500 °C, (3) high tensile modulus, and (4) UV transparency for use in UV-NIL. Various micrometer and nanometer scale patterns could be obtained from the PI molds on a large area (4 inch wafer). The imprinting results showed that the PI molds could be faithfully used for both hot embossing NIL and UV-NIL.
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Keywords: ANTIREFLECTION COATING; EFFICIENCY; INDUCTIVELY COUPLED PLASMA; OPTIMAL DESIGN; REFLECTANCE; SILICON NITRIDE; SIMULATION; SUB-WAVELENGTH STRUCTURE

Document Type: Research Article

Publication date: 2010-10-01

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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