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The Effect of Surface Roughness on In-Situ Intrinsic Tensile Stress Behavior in Cu Thin Films

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Intrinsic stress of Cu thin films, which grows in Volmer-Weber type, is reported to show the three unique stress stages, such as initial compressive, broad tensile and incremental compressive. The tensile stress stage may be related to the volume contraction through grain growth and coalescence to reduce over-piled ad-atom on surface. We observed the in-situ stresses behavior of Cu thin films during deposition using multi-beam curvature measurement system attached to a thermal evaporation device. We adopted the 100 m Si(111) substrate with different surface roughness. The effect of substrate surface roughness was assessed on in-situ tensile stress. Intrinsic tensile stress increase when substrate surface roughness increase due to the increment of surface area deposited.
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Keywords: EVAPORATION; IN-SITUINTRINSIC STRESS; SURFACE ROUGHNESS; THIN FILM

Document Type: Research Article

Publication date: 2010-05-01

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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