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Evolution of Nano-Grains in High Purity Copper by Accumulative Roll-Bonding Process

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The evolution of nano-grains in oxygen free copper with accumulative roll-bonding is investigated by TEM and EBSD analysis. The ultrafine grains developed in the sample after 8-cycle ARB. It was found that the mean spacing of grain boundaries, which was 63 m in initial material, reduced to 5.5 m after 1 cycle, then surprisingly 450 nm after 3 cycles. In addition, the fraction of high-angle boundaries in the sample after 1-cycle ARB was 0.32, but it after 3-cycle ARB was surprisingly more than 0.6. Texture development of the ARB processed samples is different depending on the number of ARB cycles.
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Keywords: ACCUMULATIVE ROLL-BONDING; ELECTRON BACK SCATTER DIFFRACTION; NANO-GRAINED COPPER; TRANSMISSION ELECTRON MICROSCOPY

Document Type: Research Article

Publication date: 2010-05-01

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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