Fabrication and Ink-Jet Patterning of Copper Nanoparticles with Improved Dispersion Stability

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Abstract:

Copper (Cu) nanoparticles as the metal nanoparticles in the conductive ink were synthesized using electrochemical reaction. This method is characterized as the synthesis process without any metal salts and the post-treatment of washing and drying. It means that it does not need to consider about oxidized and agglomerated metal nanoparticles during the extra treatments. The Cu nanoparticles were synthesized in the various conditions of electrolyte to investigate the mechanism of the synthesis reaction of Cu nanoparticles. And also, the synthesized Cu nanoparticles were controlled the dispersion stability with the addition of dispersion agent such as PVP and Dextran. Finally, it was achieved the ink-jet printed Cu patterns using the synthesized Cu nanoparticles, and examined the morphology of the patterns.

Keywords: CONDUCTIVE INK; CU NANOPARTICLES; ELECTROCHEMICAL REACTION; INK-JET PRINTING

Document Type: Research Article

DOI: http://dx.doi.org/10.1166/jnn.2010.2307

Publication date: May 1, 2010

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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