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An Investigation on Solid State Reactions in Heat Treated Au/Pd Thin Films for Electrodes Applications

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The interface between metals and oxides is particularly interesting. It has been the main topic of many research projects to illustrate that their properties are highly dependent on the structure of the interface. Poor adhesion between gold films and oxides is well known. On the basis of solid solution between the materials, the main effect of a Pd thin film as the adhesion layer between substrate and Au was investigated. Pure palladium and gold films were grown by electron beam evaporation sequentially on the SrTiO3 (001) single crystal substrates. After different annealing time (from 0.06 to 1.8 ks) at 500 °C, the growth sequence of the compositions between Au and Pd evolved as a results of the solid solution were investigated by means of X-ray photoelectron spectroscopy (XPS), X-ray diffraction. Meanwhile the surface morphology and the surface topography were examined respectively by scanning electron microscopy (SEM) and atomic force microscopy (AFM) observation. The effect of an intermediate Pd adhesion layer and its influence on the interfacial properties and morphology of the Au layer is investigated.
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Keywords: HILLOCK FORMATION; INTERDIFFUSION; THIN METALLIC FILMS

Document Type: Research Article

Publication date: 2010-04-01

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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