Properties of Cu-Based Nanocomposites Produced by Mechanically-Activated Self-Propagating High-Temperature Synthesis and Spark-Plasma Sintering
One of the possible reasons for low conductivity of in-situ produced dispersion strengthened copper matrix composites may be the incompleteness of the reaction between the initial reactants that remain in a state of solid solutions in the copper matrix. We report in-situ synthesis of TiB2-Cu composites starting from the powder mixtures with the limited content of copper ensuring a high probability of contact between the particles of titanium and boron and, as a result, their full conversion into the TiB2 phase. The nanoparticles were formed in a self-propagating mode in the ball milled Ti-B-Cu powder mixture corresponding to 57 vol.% TiB2-Cu composition. Afterwards, the system was "diluted" with the required amount of the copper matrix using subsequent ball milling. Highly conductive 4.5 vol.% TiB2-Cu composites showing 82–87% IACS (International Annealed Copper Standard) conductivity were obtained by Spark Plasma Sintering (SPS) of the powders.
No Reference information available - sign in for access.
No Citation information available - sign in for access.
No Supplementary Data.
No Article Media
Document Type: Research Article
Publication date: 2010-01-01
More about this publication?
- Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
- Editorial Board
- Information for Authors
- Subscribe to this Title
- Terms & Conditions
- Ingenta Connect is not responsible for the content or availability of external websites