Metal Patterning Process on Rigid and Flexible Substrates Using Nanoimprint Lithography and Resist Pattern Transfer Technique
Fabrication of high aspect ratio metal patterns without rabbit ear shaped defects on rigid Si and flexible polyethylene terephthalate (PET) substrates was demonstrated. This process is composed of UV nanoimprint lithography (UV-NIL), resist pattern transfer step, and lift-off process. The imprinted resist pattern with a positive pattern profile on a water soluble polyvinyl alcohol (PVA) coated transparent substrate was transferred to Si and PET substrates in order to create an undercut profile for the high fidelity lift-off process using an UV curable adhesive. After the pattern transfer step, the PVA coated substrate was released by water soaking. The adhesive residue on the substrate was removed by short O2 reactive ion etching (RIE) without significant change of the resist pattern profile. Subsequently, the metal film was deposited by e-beam evaporation on the sample and the resist pattern was removed by acetone solution. As a result, the metal patterns with 250 nm of linewidth and 80 nm of thickness were formed by this process on Si and flexible PET substrates without rabbit ear shaped defects.
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Document Type: Research Article
Publication date: 2009-07-01
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- Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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